UDZVFHTE-172.0B footprint, schematic symbol and 3D model by ROHM Semiconductor

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UDZVFHTE-172.0B Details

ROHM recommends a thermal pad size of at least 2mm x 2mm, with multiple vias connecting to a solid ground plane to ensure efficient heat dissipation.
ROHM recommends derating the voltage and current ratings according to the temperature derating curve provided in the datasheet, and ensuring proper heat sinking and thermal management.
ROHM recommends limiting voltage transients to within ±10% of the rated voltage to prevent damage to the device. Exceeding this limit may result in reduced reliability or failure.
Yes, the UDZVFHTE-172.0B is suitable for high-frequency switching applications up to 1MHz. However, ROHM recommends consulting the datasheet for specific guidance on switching losses and thermal management.
ROHM recommends following standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensuring that the device is stored in an ESD-protected environment.

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