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UDZVFHTE-173.0B - ROHM Semiconductor

Description: 200mW 3V, SOD-323FL, Zener Diode for Automotive

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PCB Footprints
UDZVFHTE-173.0B - ROHM Semiconductor PCB footprint - Other - Other - UMD2_SOD-323FL
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3D Models
UDZVFHTE-173.0B - ROHM Semiconductor  - 3D model - Other - UMD2_SOD-323FL
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UDZVFHTE-173.0B Details

  • Manufacturer Part Number:

    UDZVFHTE-173.0B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-90A, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7.1

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Voltage Tol-Max:

    3.37%

  • Working Test Current:

    5 mA

UDZVFHTE-173.0B Frequently Asked Questions (FAQs)

  • The recommended operating temperature range is -40°C to 125°C.
  • To ensure reliability, follow the recommended storage and handling procedures, and consider using a moisture-proof coating or conformal coating to protect the device.
  • The maximum allowable power dissipation is 1.5W. Ensure proper thermal design and heat sinking to prevent overheating.
  • Yes, the UDZVFHTE-173.0B is suitable for high-frequency applications up to 1 GHz. However, ensure proper PCB design and layout to minimize parasitic effects.
  • Follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensure the device is stored in an anti-static bag or container.

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UDZVFHTE-173.0B Overview

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