UDZVFHTE-175.1B footprint, schematic symbol and 3D model by ROHM Semiconductor

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UDZVFHTE-175.1B Details

A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to maintain a safe operating temperature.
Use a soldering temperature of 260°C (max) for 10 seconds (max) to prevent damage to the device. A soldering iron with a temperature control is recommended.
Yes, but ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage from vibration.
Use proper ESD handling procedures, such as wearing an ESD strap, using ESD-safe materials, and storing the device in an ESD-safe environment.

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Image	Part Number	Model
	UDZVFHTE-174.7B ROHM Semiconductor Zener Diode, 4.7V V(Z), 2.15%, 0.2W, Silicon, Unidirectional
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