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UHVB2010FCD1G00 - Stackpole Electronics, Inc.

Description: RES, HV, 2010, 1 Gohm, 1%, 6 kV

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UHVB2010FCD1G00 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - UHV2010
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UHVB2010FCD1G00 - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - UHV2010
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UHVB2010FCD1G00 Details

  • Manufacturer Part Number:

    UHVB2010FCD1G00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.76 mm

  • Package Length:

    5.08 mm

  • Package Style:

    SMT

  • Package Width:

    2.54 mm

  • Packing Method:

    TR, Plastic

  • Rated Power Dissipation (P):

    0.036 W

  • Resistance:

    1000000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    6000 V

UHVB2010FCD1G00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the UHVB2010FCD1G00 can be found in the Stackpole Electronics Inc. application note AN-101, which provides detailed guidelines for PCB layout and assembly.
  • To handle the high current rating of the UHVB2010FCD1G00, ensure that your PCB design includes adequate copper thickness, track width, and thermal vias to dissipate heat effectively. Consult with a PCB design expert or refer to IPC standards for guidance.
  • While the UHVB2010FCD1G00 has a high operating temperature range, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments. Consult with a thermal management expert or refer to the datasheet for guidance.
  • Follow the recommended soldering profile and assembly guidelines provided in the Stackpole Electronics Inc. application note AN-102, which includes detailed instructions for reflow soldering, wave soldering, and manual assembly.
  • The UHVB2010FCD1G00 is sensitive to electrostatic discharge (ESD). Handle the component with ESD-protective equipment, follow proper handling and storage procedures, and ensure that your production line has ESD protection measures in place.

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UHVB2010FCD1G00 Overview

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Part Image UHVB2010FTD1G00 SEI Stackpole Electronics Inc

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Part Image UHVS2010FKD1G00 SEI Stackpole Electronics Inc

Fixed Resistor, 1000000000ohm, 6000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

Part Image UHVS2010FDD1G00 SEI Stackpole Electronics Inc

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Part Image UHVS2010FCD1G00 SEI Stackpole Electronics Inc

Fixed Resistor, 1000000000ohm, 6000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

Part Image UHVB2010FKD1G00 SEI Stackpole Electronics Inc

Fixed Resistor, 1000000000ohm, 6000V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2010, CHIP

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