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UJA1162ATK/0Z - NXP

Description: CAN Interface IC Self-supplied high-speed CAN transceiver with Sleep mode

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UJA1162ATK/0Z - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - UJA1162ATK/0Z
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UJA1162ATK/0Z - NXP  - 3D model - Small Outline No-lead - UJA1162ATK/0Z
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UJA1162ATK/0Z Details

  • Manufacturer Part Number:

    UJA1162ATK/0Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON-14

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Additional Feature:

    ESD FOR BAT, WAKE IS 3A AND CANH,CANL IS 3B

  • Data Rate:

    5000 Mbps

  • JESD-30 Code:

    R-PDSO-N14

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC14,.12,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    67 mA

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

UJA1162ATK/0Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the UJA1162ATK/0Z involves placing the device close to the battery, using a solid ground plane, and keeping the high-current paths short and wide. It's also recommended to use a common ground point for the device and the battery.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which involves applying the battery voltage to the device before applying the ignition voltage. Also, ensure that the device is properly configured and initialized through the SPI interface.
  • The UJA1162ATK/0Z has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. It's also recommended to use a thermal interface material and to ensure good airflow around the device.
  • To troubleshoot issues with the UJA1162ATK/0Z, start by checking the power supply and battery voltage, then verify the device configuration and initialization. Use a logic analyzer or oscilloscope to debug the SPI interface and check for any error flags or fault indicators.
  • The UJA1162ATK/0Z has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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UJA1162ATK/0Z Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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