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UJA1167ATK/0Z - NXP

Description: CAN Interface IC Mini high-speed CAN system basis chip with Standby/Sleep modes & watchdog

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Symbol
UJA1167ATK/0Z - NXP - PCB symbol
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PCB Footprints
UJA1167ATK/0Z - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - HVSON14
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3D Models
UJA1167ATK/0Z - NXP - 3D model - Small Outline No-lead - HVSON14
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UJA1167ATK/0Z Details

  • Manufacturer Part Number:

    UJA1167ATK/0Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON-14

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6.45

  • Data Rate:

    5000 Mbps

  • JESD-30 Code:

    R-PDSO-N14

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC14,.12,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    28 mA

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN TRANSCEIVER

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

UJA1167ATK/0Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the UJA1167ATK/0Z involves placing the device close to the battery, using a solid ground plane, and keeping the high-current paths short and wide. It's also recommended to use a common ground point for the device and the battery.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence, which involves applying the battery voltage to the device before applying the ignition voltage. Also, ensure that the device is properly configured and initialized through the SPI interface.
  • The UJA1167ATK/0Z has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. It's also recommended to use a thermal interface material and to ensure good airflow around the device.
  • To troubleshoot issues with the UJA1167ATK/0Z, start by checking the power supply and clock signals, then verify the SPI communication and configuration. Use a logic analyzer or oscilloscope to debug the device's behavior and identify any issues.
  • The UJA1167ATK/0Z has built-in ESD protection, but it's still important to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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UJA1167ATK/0Z Overview

Use the download button to access the UJA1167ATK/0Z schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like UJA11, or try a keyword search, such as Network Interfaces

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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