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ULQ2003D1013TR - STMicroelectronics

Description: ULQ2003D1013TR, Darlington Transistor Array, NPN 0.5 A 50 V, Array 7, 16-Pin, SO

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ULQ2003D1013TR - STMicroelectronics - PCB symbol
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PCB Footprints
ULQ2003D1013TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-16N
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3D Models
ULQ2003D1013TR - STMicroelectronics - 3D model - Small Outline Packages - SO-16N
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ULQ2003D1013TR Details

  • Manufacturer Part Number:

    ULQ2003D1013TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    7

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-COLLECTOR

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    50 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

ULQ2003D1013TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range, and that the PCB is designed to dissipate heat efficiently. Also, consider using a heat sink or thermal pad to reduce the junction temperature.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Avoid touching the device pins or leads, and use an anti-static wrist strap or mat when handling the device.
  • To troubleshoot issues with the device, start by reviewing the datasheet and application notes to ensure correct usage. Check the device's operating conditions, power supply, and signal integrity. Use oscilloscopes or logic analyzers to debug the issue, and consider consulting with STMicroelectronics' technical support or a qualified engineer.
  • When using the device in a high-reliability or safety-critical application, ensure that the device is operated within its recommended specifications, and that the system is designed with redundancy and fail-safes. Consider using redundant devices, error detection and correction mechanisms, and implementing safety protocols to mitigate potential failures.

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ULQ2003D1013TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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