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ULQ2003D1013TRY - STMicroelectronics

Description: Darlington Transistors POWER MANAGEMENT

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ULQ2003D1013TRY - STMicroelectronics - PCB symbol
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ULQ2003D1013TRY - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-16 Narrow_
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ULQ2003D1013TRY - STMicroelectronics - 3D model - Small Outline Packages - SO-16 Narrow_
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ULQ2003D1013TRY Details

  • Manufacturer Part Number:

    ULQ2003D1013TRY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.98

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    7

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-COLLECTOR

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    50 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

ULQ2003D1013TRY Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the PCB traces away from the device's thermal pad.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended temperature range (–40°C to 150°C). Use a heat sink or thermal pad to dissipate heat, and avoid overheating the device. Also, consider using a thermally conductive adhesive or thermal interface material to improve heat transfer.
  • The recommended soldering conditions for the ULQ2003D1013TRY are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point of 217°C to 220°C. Avoid using excessive soldering temperatures or times, as this can damage the device.
  • To handle ESD protection for the ULQ2003D1013TRY, use an ESD wrist strap or mat when handling the device. Ensure that the device is stored in an ESD-protected environment, and use ESD-protected packaging materials. Avoid touching the device's pins or leads, and use an ESD-protected workstation or bench.
  • The recommended storage conditions for the ULQ2003D1013TRY are: temperature range of –40°C to 30°C, relative humidity of 60% or less, and protection from direct sunlight. Store the device in its original packaging or an ESD-protected container, and avoid exposing it to moisture or contaminants.

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ULQ2003D1013TRY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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