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UM9603 - Microsemi Corporation

Description: MICROSTRIP 900 MHz ANTENNNA SWITCHES C OS O S ANDMICROWAVEAPPLICATIONS

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UM9603 - Microsemi Corporation  - 3D model
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UM9603 Details

  • Manufacturer Part Number:

    UM9603

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HERMETIC SEALED, GLASS PACKAGE-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    SWITCHING

  • Breakdown Voltage-Min:

    100 V

  • Configuration:

    SINGLE

  • Diode Capacitance-Max:

    1.2 pF

  • Diode Capacitance-Nom:

    1.2 pF

  • Diode Element Material:

    SILICON

  • Diode Forward Resistance-Max:

    0.6 Ω

  • Diode Res Test Current:

    100 mA

  • Diode Res Test Frequency:

    100 MHz

  • Diode Type:

    PIN DIODE

  • Frequency Band:

    ULTRA HIGH FREQUENCY TO S BAND

  • JESD-30 Code:

    O-LEMW-N2

  • Minority Carrier Lifetime-Nom:

    2 µs

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    MICROWAVE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    1.5 W

  • Qualification Status:

    Not Qualified

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    POSITIVE-INTRINSIC-NEGATIVE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    END

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

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UM9603 Overview

Use the download button to access the UM9603 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like UM960, or try a keyword search, such as PIN Diodes

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