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UPD70F3033BYGC-8EU - Renesas Electronics

Description: The V850/SB1 and V850/SB2 Group are supported only for customers who have already adopted these products.

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PCB Footprints
UPD70F3033BYGC-8EU - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQP0100KI-B
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3D Models
UPD70F3033BYGC-8EU - Renesas Electronics  - 3D model - Quad Flat Packages - PLQP0100KI-B
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UPD70F3033BYGC-8EU Details

  • Manufacturer Part Number:

    UPD70F3033BYGC-8EU

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PLQP0100KI

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bit Size:

    32

  • CPU Family:

    V850

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e0

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    16384

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Speed:

    20 MHz

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

UPD70F3033BYGC-8EU Overview

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