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UPD70F3736GK-GAK-AX - Renesas Electronics

Description: The V850ES/Jx3-L is a 32-bit single-chip microcontroller that includes the V850ES CPU core and peripheral functions such as ROM/RAM, timer/counters, serial interfaces, an A/D converter, and a D/A converter and enables an extremely high cost-performance for applications that require super low power consumption, such as digital cameras, electrical power meters, and mobile terminals.

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UPD70F3736GK-GAK-AX - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - 80-PIN PLASTIC LQFP (FINE PITCH) (12x12)
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UPD70F3736GK-GAK-AX - Renesas Electronics  - 3D model - Quad Flat Packages - 80-PIN PLASTIC LQFP (FINE PITCH) (12x12)
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UPD70F3736GK-GAK-AX Details

  • Manufacturer Part Number:

    UPD70F3736GK-GAK-AX

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Package Description:

    12 X 12 MM, LEAD FREE, PLASTIC, LQFP-80

  • Pin Count:

    80

  • Manufacturer Package Code:

    PLQP0080KE

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 2.2V SUPPLY AT 5 MHZ

  • Address Bus Width:

    18

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    V850

  • Clock Frequency-Max:

    10 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e4

  • Length:

    12 mm

  • Number of I/O Lines:

    66

  • Number of Terminals:

    80

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP80,.55SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    16384

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

UPD70F3736GK-GAK-AX Frequently Asked Questions (FAQs)

  • Renesas recommends a thermal pad on the bottom of the package, connected to a solid copper plane on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended for the PCB.
  • To ensure a reliable WDT reset, use an external capacitor (e.g., 0.1uF) between the WDT pin and VCC, and configure the WDT to reset the MCU when the timer expires. Also, ensure the WDT is enabled and configured correctly in the software.
  • The maximum allowed voltage on the analog input pins is VCC + 0.3V, but it's recommended to keep the input voltage within the VCC range to ensure accurate ADC conversions.
  • To optimize power consumption in low-power modes, use the MCU's built-in power management features, such as the Low Power Mode (LPM) and the Power Down Mode (PDM). Disable unnecessary peripherals, and use clock gating to reduce power consumption.
  • Renesas recommends using a 12MHz or 16MHz oscillator crystal with a load capacitance of 10pF to 20pF for optimal performance and stability.

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UPD70F3736GK-GAK-AX Overview

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