UPSD3354D-40U6 footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

UPSD3354D-40U6 - STMicroelectronics PCB footprint - Other - Other - QFP50P1400X1400X160-80N

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Part Number UPSD3354D-40U6
Manufacturer STMicroelectronics
Pin Count 80
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - QFP50P1400X1400X160-80N
Released Date Jan 12, 2017
Last Modified Date Nov 15, 2024 1:35 PM UTC
Pinout / Pin List Click Here (Member Only)

UPSD3354D-40U6 Details

Manufacturer Part Number:
UPSD3354D-40U6
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
QFP
Package Description:
PLASTIC, TQFP-80
Pin Count:
80
ECCN Code:
3A991.a.2
HTS Code:
8542.31.00.15
Manufacturer:
STMicroelectronics
YTEOL:
0
Has ADC:
YES
Address Bus Width:
12
Bit Size:
8
Boundary Scan:
YES
CPU Family:
8051
Clock Frequency-Max:
40 MHz
DAC Channels:
YES
DMA Channels:
NO
External Data Bus Width:
8
JESD-30 Code:
S-PQFP-G80
JESD-609 Code:
e3/e4
Length:
12 mm
Number of I/O Lines:
46
Number of Terminals:
80
On Chip Program ROM Width:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
PWM Channels:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFQFP
Package Equivalence Code:
QFP80,.55SQ,20
Package Shape:
SQUARE
Package Style:
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
RAM (bytes):
32768
ROM (words):
262144
ROM Programmability:
FLASH
Seated Height-Max:
1.6 mm
Speed:
40 MHz
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
TIN/NICKEL PALLADIUM GOLD
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
12 mm
uPs/uCs/Peripheral ICs Type:
MICROCONTROLLER

UPSD3354D-40U6 Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the UPSD3354D-40U6 near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from STMicroelectronics provides additional recommendations.
To ensure reliable communication, make sure to follow the recommended interface protocol, use a stable clock signal, and implement error detection and correction mechanisms. Additionally, consider using a UART or SPI interface with a dedicated clock line to reduce noise and interference.
The UPSD3354D-40U6 requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input signals. The power-down sequence should be reversed. Refer to the datasheet for more details.
The UPSD3354D-40U6 has built-in POR and BOR features to ensure reliable startup and operation. To handle these features, ensure that the power supply is stable and within the recommended voltage range. Also, consider adding external circuitry to filter out noise and voltage spikes.
The UPSD3354D-40U6 has a maximum junction temperature of 150°C. To manage thermal performance, ensure good airflow, use a heat sink or thermal pad, and avoid overheating the device. Monitor the device's temperature and adjust the system design accordingly.

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UPSD3354D-40U6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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