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US1DFA - onsemi

Description: Fast Switching Reverse Recovery Time: 50~75 ns Maximum; Glass Passivated Chip Junction; MSL 1 per J-STD-020; UL Flammability 94V-0 Classification; Low Power Loss, High Efficiency; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free and are RoHS Compliant

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PCB Footprints
US1DFA - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL CASE 425AB Issue O
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3D Models
US1DFA - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-123FL CASE 425AB Issue O
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US1DFA Details

  • Manufacturer Part Number:

    US1DFA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    200 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

US1DFA Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces as short as possible and use a common mode choke to reduce EMI.
  • The US1DFA requires a bias voltage of 5V ± 10% on the VCC pin. Ensure the bias voltage is stable and noise-free, and use a decoupling capacitor of at least 10uF between VCC and GND.
  • The US1DFA can handle input signal amplitudes up to 10Vpp differential. Exceeding this limit may cause distortion or damage to the device.
  • Use a shielded enclosure, keep the PCB layout compact, and use a common mode choke to reduce EMI emissions. Ensure the device is properly grounded and use EMI-absorbing materials if necessary.
  • The US1DFA is rated for operation from -40°C to 125°C. Operating outside this range may affect device performance or reliability.

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US1DFA Overview

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