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US1G-13-F - Diodes Incorporated

Description: Diode Switching 400V 1A 2Pin SMA Diodes Inc US1G-13-F Switching Diode, 1A 400V, 2-Pin SMA

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US1G-13-F - Diodes Incorporated - PCB symbol
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PCB Footprints
US1G-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMA
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3D Models
US1G-13-F - Diodes Incorporated - 3D model - Diodes Moulded - SMA
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US1G-13-F Details

  • Manufacturer Part Number:

    US1G-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMA

  • Similar Group:

    DI08100910019148

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

US1G-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the US1G-13-F is a standard SOT23-5 package with a 1.7mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the thermal derating curve provided in the datasheet. Additionally, ensure good thermal conduction between the device and the PCB, and consider using a heat sink if necessary.
  • The maximum allowable voltage on the enable pin (EN) of the US1G-13-F is 6V. Exceeding this voltage may cause damage to the device.
  • Yes, the US1G-13-F can be used in switching regulator applications. However, ensure that the device is properly bypassed and decoupled to minimize noise and voltage transients. Additionally, consider the device's power dissipation and thermal characteristics when designing the switching regulator circuit.
  • The typical turn-on and turn-off time of the US1G-13-F is around 1-2μs. However, this may vary depending on the specific application and circuit conditions.

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US1G-13-F Overview

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