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US1GFA - onsemi

Description: Low Power Loss, High Efficiency; Glass Passivated Chip Junction; Fast Switching Reverse Recovery Time: 50~75 ns Maximum; MSL 1 per J-STD-020; UL Flammability 94V-0 Classification; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free and are RoHS Compliant

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PCB Footprints
US1GFA - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - ST715C33R
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3D Models
US1GFA - onsemi  - 3D model - Small Outline Diode Flat Lead - ST715C33R
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US1GFA Details

  • Manufacturer Part Number:

    US1GFA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    400 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

US1GFA Frequently Asked Questions (FAQs)

  • A good PCB layout for the US1GFA involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it away from the device can help reduce EMI.
  • To ensure the US1GFA operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive voltage, current, or temperature, and that the thermal design is adequate to dissipate heat.
  • The recommended input capacitor value for the US1GFA is 10uF to 22uF, with a voltage rating of 50V or higher. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended for optimal performance.
  • To troubleshoot issues with the US1GFA, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or thermal shutdown. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the US1GFA is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q100, a standard for automotive-grade ICs. However, ensure that the device is properly qualified and validated for the specific application, and that all relevant testing and certification requirements are met.

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US1GFA Overview

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