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US1KFA - onsemi

Description: Fast Switching Reverse Recovery Time: 50~75 ns Maximum; Low Power Loss, High Efficiency; UL Flammability 94V-0 Classification; MSL 1 per J-STD-020; Glass Passivated Chip Junction; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free and are RoHS Compliant

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PCB Footprints
US1KFA - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FA
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3D Models
US1KFA - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-123FA
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US1KFA Details

  • Manufacturer Part Number:

    US1KFA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    800 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

US1KFA Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Ensure the PCB is designed for lead-free soldering.
  • Implement a robust EOS protection scheme, including TVS diodes, resistors, and capacitors. Ensure the device is operated within the recommended voltage and current ratings.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Handle the devices by the body, avoiding touching the leads or die. Use an anti-static wrist strap or mat when handling the devices.

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US1KFA Overview

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Rectifier Diode, 1 Phase, 1 Element, 1A, 800V V(RRM), Silicon