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US1M-13-F - Diodes Incorporated

Description: Diode Fast 1A 1000V 75ns SMA Diodes Inc US1M-13-F, SMT Switching Diode, 1000V 1A, 75ns, 2-Pin DO-214AC

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Symbol
US1M-13-F - Diodes Incorporated - PCB symbol
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PCB Footprints
US1M-13-F - Diodes Incorporated PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - US1M-13-F 1
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3D Models
US1M-13-F - Diodes Incorporated - 3D model - Small Outline Diode Flat Lead - US1M-13-F 1
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US1M-13-F Details

  • Manufacturer Part Number:

    US1M-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    255

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

US1M-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the US1M-13-F is a standard SOT23-5 package with a 1.7mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power dissipation according to the thermal derating curve provided in the datasheet. Additionally, ensure good thermal conduction between the device and the PCB, and consider using a heat sink if necessary.
  • The maximum allowable voltage on the enable pin (EN) of the US1M-13-F is 6V. Exceeding this voltage may cause damage to the device.
  • Yes, the US1M-13-F can be used in a switching regulator application. However, ensure that the device is operated within its recommended operating conditions, and consider the device's power dissipation and thermal characteristics when designing the regulator circuit.
  • The typical turn-on and turn-off time of the US1M-13-F is around 10-20ns. However, this may vary depending on the specific application and operating conditions.

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US1M-13-F Overview

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