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US2D-TP - MCC

Description: Diode 200 V 2A Surface Mount DO-214AA (SMB)

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Symbol
US2D-TP - MCC - PCB symbol
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PCB Footprints
US2D-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMB (DO-214AA)
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3D Models
US2D-TP - MCC - 3D model - Diodes Moulded - SMB (DO-214AA)
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US2D-TP Details

  • Manufacturer Part Number:

    US2D-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMB, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

US2D-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance of the US2D-TP involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. Additionally, it is recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the reliability of the US2D-TP in high-temperature applications, it is recommended to follow proper thermal management practices, such as using a heat sink, ensuring good airflow, and keeping the device away from heat sources. Additionally, the device should be operated within its specified temperature range, and the power dissipation should be kept within the recommended limits.
  • The US2D-TP has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures when handling the device. This includes using an ESD wrist strap, working on an ESD mat, and storing the device in an ESD-safe environment. Additionally, the device should be handled by the body only, and not by the leads.
  • Yes, the US2D-TP can be used in automotive applications, but it is recommended to follow the AEC-Q100 qualification standard for automotive-grade devices. Additionally, the device should be operated within its specified temperature range, and the power dissipation should be kept within the recommended limits.
  • The recommended storage condition for the US2D-TP is in a dry, cool place, away from direct sunlight and moisture. The device should be stored in its original packaging or in a similar ESD-safe environment, and the storage temperature should be between -40°C and 125°C.

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US2D-TP Overview

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For a full list of alternate parts for US2D-TP, check out Findchips.com