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US2FA - onsemi

Description: High Surge Capacity; UL Flammability 94V-0 Classification; RoHS Compliant / Green Molding Compound; Glass Passivated Chip Junction; Low Forward Voltage Drop; MSL 1 per J-STD-020; Fast Switching with Reverse Recovery Time: 50~75 ns Maximum; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable*

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PCB Footprints
US2FA - onsemi PCB footprint - Other - Other - DO-214AC (SMA)
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3D Models
US2FA - onsemi  - 3D model - Other - DO-214AC (SMA)
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US2FA Details

  • Manufacturer Part Number:

    US2FA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    300 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

US2FA Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or a ferrite bead to reduce EMI.
  • Use a reliable communication protocol such as I2C or SPI, and ensure that the clock frequency is within the recommended range. Implement error checking and correction mechanisms to detect and correct data transmission errors.
  • The US2FA is rated for operation from -40°C to 85°C. However, the device may not function optimally at extreme temperatures. Ensure proper thermal management and heat dissipation to maintain optimal performance.
  • Yes, the US2FA is designed to withstand vibrations up to 10G. However, ensure that the device is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • Use a logic analyzer or oscilloscope to monitor the communication signals. Check the power supply voltage and ensure that it is within the recommended range. Consult the datasheet and application notes for troubleshooting guidelines.

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US2FA Overview

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