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USB3317C-GJ-TR - Microchip

Description: Transceiver USB 2.0 25-BGA (3x3) 2.2uF , 100mV , 480MHz , 1.6V ~ 3.6V , -40°C ~ 85°C

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USB3317C-GJ-TR - Microchip - PCB symbol
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PCB Footprints
USB3317C-GJ-TR - Microchip PCB footprint - BGA - BGA - 25VFBGA-3x3B-0.5P
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3D Models
USB3317C-GJ-TR - Microchip - 3D model - BGA - 25VFBGA-3x3B-0.5P
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USB3317C-GJ-TR Details

  • Manufacturer Part Number:

    USB3317C-GJ-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VFBGA-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    VFBGA-25

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Bus Compatibility:

    USB, VBUS

  • Clock Frequency-Max:

    26 MHz

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    34 mA

  • Supply Voltage-Max:

    2 V

  • Supply Voltage-Min:

    1.6 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB3317C-GJ-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the USB3317C-GJ-TR involves keeping the high-speed USB traces short and away from noise sources, using a solid ground plane, and minimizing vias and layer changes. Microchip provides a recommended PCB layout in their application notes.
  • To ensure EMC compliance, follow proper PCB design and layout guidelines, use shielding and filtering as needed, and test the design according to relevant EMC standards such as FCC Part 15 or EN 301 489-17.
  • The USB3317C-GJ-TR has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and follow thermal design guidelines to prevent overheating and ensure reliable operation.
  • Use oscilloscopes and logic analyzers to debug signal integrity issues, and check power supply voltage and current to identify power-related issues. Consult Microchip's application notes and technical support resources for guidance.
  • The USB3317C-GJ-TR requires a compatible firmware or software driver to operate correctly. Consult Microchip's documentation and software development kits (SDKs) for specific requirements and implementation details.

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USB3317C-GJ-TR Overview

Use the download button to access the USB3317C-GJ-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like USB33, or try a keyword search, such as Bus Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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