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USB3322C-GL-TR - Microchip

Description: Microchip USB3322C-GL-TR, USB Transceiver, USB 2.0, 1.8 V, 3.3 V, 25-Pin WLCSP

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Symbol
USB3322C-GL-TR - Microchip - PCB symbol
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PCB Footprints
USB3322C-GL-TR - Microchip PCB footprint - BGA - BGA - 25WLCSP, 2.0 X 2.0MM BODY, 0.4MM PITCH
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3D Models
USB3322C-GL-TR - Microchip - 3D model - BGA - 25WLCSP, 2.0 X 2.0MM BODY, 0.4MM PITCH
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USB3322C-GL-TR Details

  • Manufacturer Part Number:

    USB3322C-GL-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    WLCSP-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    WLCSP-25

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Bus Compatibility:

    UART; USB

  • Clock Frequency-Max:

    27 MHz

  • Drive Interface Standard:

    USB

  • External Data Bus Width:

    7

  • JESD-30 Code:

    S-PBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    1.97 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.62 mm

  • Supply Current-Max:

    29.4 mA

  • Supply Voltage-Max:

    2 V

  • Supply Voltage-Min:

    1.6 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.97 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB3322C-GL-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the USB3322C-GL-TR involves keeping the USB traces as short as possible, using a solid ground plane, and minimizing vias and layer changes. It's also recommended to use a common mode filter and a shielded cable to reduce EMI.
  • To ensure compliance with USB 3.2 Gen 2 specifications, follow the guidelines outlined in the USB 3.2 specification, use a certified USB 3.2 cable, and perform thorough testing of your design, including signal integrity and compliance testing.
  • The USB3322C-GL-TR has a typical power consumption of 150mA. Thermal considerations include keeping the device junction temperature below 125°C, using a heat sink if necessary, and ensuring good airflow around the device.
  • To implement a robust and reliable USB 3.2 Gen 2 interface, follow best practices for PCB design, use a high-quality USB connector, and ensure that your design meets the USB 3.2 specification. Additionally, perform thorough testing, including stress testing and environmental testing.
  • Key considerations for EMI and RFI mitigation when using the USB3322C-GL-TR include using a shielded cable, minimizing loop areas, using a common mode filter, and ensuring good PCB layout practices, such as keeping signals away from the edge of the board.

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USB3322C-GL-TR Overview

Use the download button to access the USB3322C-GL-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like USB33, or try a keyword search, such as Bus Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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Part Image USB3322C-GL Microchip Technology Inc

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