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USB3503AI-1-GL-TR - Microchip

Description: Low Speed/Full Speed/High Speed Hub Controller USB 2.0 3.3V/5V T/R 25-Pin WLCSP

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PCB Footprints
USB3503AI-1-GL-TR - Microchip PCB footprint - BGA - BGA - 25 Ball DSe1, 0.4mm Pitch
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3D Models
USB3503AI-1-GL-TR - Microchip  - 3D model - BGA - 25 Ball DSe1, 0.4mm Pitch
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USB3503AI-1-GL-TR Details

  • Manufacturer Part Number:

    USB3503AI-1-GL-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    1.97 X 1.97 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    WLCSP-25

  • Country Of Origin:

    South Korea, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Bus Compatibility:

    I2C; USB

  • Clock Frequency-Max:

    52 MHz

  • Data Transfer Rate-Max:

    0.125 MBps

  • JESD-30 Code:

    S-PBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    1.97 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.62 mm

  • Supply Current-Max:

    110 mA

  • Supply Voltage-Max:

    2 V

  • Supply Voltage-Min:

    1.6 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.97 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB3503AI-1-GL-TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the USB3503AI-1-GL-TR involves keeping the USB traces as short as possible, using a solid ground plane, and minimizing the number of vias. It's also recommended to use a common mode filter and a shielded cable to reduce EMI.
  • To ensure reliable operation of the USB3503AI-1-GL-TR in high-temperature environments, it's recommended to use a heat sink, ensure good airflow, and follow proper thermal design guidelines. Additionally, consider using a thermal pad or thermal interface material to improve heat transfer.
  • The recommended power supply decoupling capacitors for the USB3503AI-1-GL-TR are 10uF and 100nF capacitors, placed as close as possible to the device's power pins. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot USB connectivity issues with the USB3503AI-1-GL-TR, check the USB cable and connector for damage, ensure that the device is properly powered, and verify that the USB host controller is functioning correctly. Use a USB protocol analyzer to debug the issue if necessary.
  • When using the USB3503AI-1-GL-TR in a system with multiple USB devices, ensure that each device has a unique address, and that the total USB bandwidth is not exceeded. Additionally, consider using a USB hub or switch to manage the devices and reduce the load on the host controller.

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USB3503AI-1-GL-TR Overview

Use the download button to access the USB3503AI-1-GL-TR schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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