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USB5537B-6080AKZE - Microchip

Description: Low Speed/Full Speed/High Speed/Super Speed Hub Controller USB 2.0/USB 3.0 1.25V/3.3V Tray 72-Pin QFN EP

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PCB Footprints
USB5537B-6080AKZE - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - AP-72QFN-60004-10x10B
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3D Models
USB5537B-6080AKZE - Microchip  - 3D model - Quad Flat No-Lead - AP-72QFN-60004-10x10B
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USB5537B-6080AKZE Details

  • Manufacturer Part Number:

    USB5537B-6080AKZE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    10 X 10 MM, 0.50 MM PITCH, MO-220, QFN-72

  • Pin Count:

    72

  • Manufacturer Package Code:

    VQFN-72

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Additional Feature:

    ALSO OPERATES AT 3.3 V SUPPLY

  • Bus Compatibility:

    I2C; SMBUS; SPI; USB

  • Clock Frequency-Max:

    25 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-XQCC-N72

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Number of Terminals:

    72

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC72,.39SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    1173 mA

  • Supply Voltage-Max:

    1.31 V

  • Supply Voltage-Min:

    1.22 V

  • Supply Voltage-Nom:

    1.25 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB5537B-6080AKZE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or ferrite bead to reduce EMI.
  • Use a high-quality USB 3.2 Gen 2 cable, ensure the PCB is designed for high-speed signals, and follow the recommended layout guidelines. Also, use a signal integrity tool to simulate and optimize the signal transmission.
  • The device has a thermal pad on the bottom. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • Use a power sequencing controller or a dedicated power management IC to ensure proper power-up and power-down sequencing. Use a low-dropout regulator (LDO) or a switching regulator to regulate the voltage supply.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the USB data lines and power lines. Ensure that the PCB design and layout minimize the risk of ESD damage.

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USB5537B-6080AKZE Overview

Use the download button to access the USB5537B-6080AKZE schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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