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USB5806C-I/KD - Microchip

Description: USB Interface IC USB3.1, Gen 1 / 5 Gbps, 6 port Smart Hub/ Feature Controller, USB C Mux, USB Type A port for Upstream

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PCB Footprints
USB5806C-I/KD - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 100 vqfn
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3D Models
USB5806C-I/KD - Microchip  - 3D model - Quad Flat No-Lead - 100 vqfn
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USB5806C-I/KD Details

  • Manufacturer Part Number:

    USB5806C-I/KD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    VQFN-100

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2019-07-19

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Bus Compatibility:

    I2C; SMBUS; SPI; UART

  • Clock Frequency-Max:

    25 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-XQCC-N100

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC100,.47SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.08 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB5806C-I/KD Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-speed USB traces short and away from noise sources. Use a common mode filter and a shielded cable to reduce EMI.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow and avoid blocking airflow around the device. Consider using a thermal interface material to improve heat transfer.
  • Use 39Ω ±1% resistors for the USB differential pairs (D+ and D-) to ensure signal integrity and minimize reflections.
  • Use a 3.3V or 5V power supply with a low-dropout regulator (LDO) to ensure a stable voltage supply. Consider using a power management IC (PMIC) for more complex power management requirements.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Store the device in an anti-static bag or tube.

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USB5806C-I/KD Overview

Use the download button to access the USB5806C-I/KD schematic symbol, PCB footprint, and 3D model.
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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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