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USB5807C-I/KD - Microchip

Description: USB Interface IC USB3.1, Gen 1 / 5 Gbps, 7 port hub, USB C Mux, USB Type A port for Upstream

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USB5807C-I/KD - Microchip - PCB symbol
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PCB Footprints
USB5807C-I/KD - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - FIGURE 10-1: 100-VQFN PACKAGE (DRAWING)
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3D Models
USB5807C-I/KD - Microchip - 3D model - Quad Flat No-Lead - FIGURE 10-1: 100-VQFN PACKAGE (DRAWING)
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USB5807C-I/KD Details

  • Manufacturer Part Number:

    USB5807C-I/KD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    VQFN-100

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Additional Feature:

    also available with 3.3v supply

  • Bus Compatibility:

    I2C; SMBUS; SPI; USB

  • Clock Frequency-Max:

    25 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PQCC-N100

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC100,.47SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.08 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB5807C-I/KD Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-speed USB traces short and away from noise sources. Use a common mode filter and a shielded cable to reduce EMI.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material to improve heat transfer. Operate the device within the recommended temperature range (0°C to 70°C).
  • Use a clean, regulated power supply with minimal noise and ripple. Ensure the power supply can provide the required current (up to 500mA). Use decoupling capacitors (e.g., 10uF and 100nF) to filter out noise.
  • Check the USB cable and connector for damage or corrosion. Verify the device is properly configured and enumerated. Use a USB protocol analyzer to debug the communication. Check the device's power management settings.
  • Consider the device's power consumption (typically 100mA) and plan accordingly. Use power-saving modes (e.g., suspend, idle) to minimize power consumption. Optimize the system's power management to ensure efficient power usage.

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USB5807C-I/KD Overview

Use the download button to access the USB5807C-I/KD schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like USB58, or try a keyword search, such as Bus Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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