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USB5807T-I/KD - Microchip

Description: USB Interface IC USB3.1, Gen 1 / 5 Gbps, 7 port hub, USB C Mux, USB Type A port for Upstream

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USB5807T-I/KD - Microchip - PCB symbol
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PCB Footprints
USB5807T-I/KD - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 100-VQFN C04-407
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3D Models
USB5807T-I/KD - Microchip - 3D model - Quad Flat No-Lead - 100-VQFN C04-407
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USB5807T-I/KD Details

  • Manufacturer Part Number:

    USB5807T-I/KD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFN-100

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Date Of Intro:

    2016-10-03

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Bus Compatibility:

    I2C; SMBUS; SPI

  • Clock Frequency-Max:

    25 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-XQCC-N100

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC100,.47SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.08 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB5807T-I/KD Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the USB traces as short as possible and away from noise sources. Use a common mode filter and a shielded cable to reduce EMI.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Reduce the current load or use a lower power mode to reduce heat generation. Consider using a thermal interface material to improve heat transfer.
  • Use a clean and regulated power supply. Decouple the power pins with 10uF and 100nF capacitors. Use a power-on reset circuit to ensure a clean power-up sequence. Avoid voltage drops and noise on the power lines.
  • Use a USB protocol analyzer to capture and analyze the USB traffic. Check the device's USB configuration and device descriptor. Verify the device is properly enumerated and configured. Check for signal integrity issues and electromagnetic interference (EMI).
  • Use a low-power mode or suspend mode to reduce power consumption. Implement power management techniques like dynamic voltage and frequency scaling. Consider using a power gating technique to reduce standby power consumption.

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USB5807T-I/KD Overview

Use the download button to access the USB5807T-I/KD schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like USB58, or try a keyword search, such as Bus Controllers

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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