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V2PM15-M3/H - Vishay

Description: Schottky Diodes & Rectifiers 150V 2A TMBS MicroSMP

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PCB Footprints
V2PM15-M3/H - Vishay PCB footprint - Other - Other - V2PM15-M3/H-4
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3D Models
V2PM15-M3/H - Vishay  - 3D model - Other - V2PM15-M3/H-4
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V2PM15-M3/H Details

  • Manufacturer Part Number:

    V2PM15-M3/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.07

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.41 V

  • JEDEC-95 Code:

    DO-219AD

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    50 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

V2PM15-M3/H Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper area under the device, connected to a solid ground plane, and to use thermal vias to dissipate heat. Additionally, keeping the component away from other heat sources and using a thermal interface material can help improve thermal performance.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component. Avoid overheating or applying excessive force, which can damage the device.
  • The maximum allowed voltage derating for the V2PM15-M3/H is typically 10% to 15% below the maximum rated voltage. This is to ensure reliable operation and to prevent premature failure due to voltage stress.
  • The V2PM15-M3/H is designed for low-frequency applications. While it can be used in high-frequency applications, its performance may be limited by its internal capacitance and inductance. It's recommended to consult with a Vishay application engineer or to perform thorough simulations and testing to ensure the device meets the requirements of the high-frequency application.
  • To handle the high power dissipation, ensure good thermal contact between the device and the heat sink or PCB. Use a heat sink with a high thermal conductivity, and apply a thermal interface material to fill any gaps. Additionally, consider using a fan or other cooling system to keep the device within its recommended operating temperature range.

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V2PM15-M3/H Overview

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