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V4PAL45HM3_A/I - Vishay

Description: Vishay 45V 4A, Schottky Diode, 2-Pin DO-221BC V4PAL45HM3_A/I

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Symbol
V4PAL45HM3_A/I - Vishay - PCB symbol
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PCB Footprints
V4PAL45HM3_A/I - Vishay PCB footprint - Other - Other - DO-221BC (SMPA)-1
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3D Models
V4PAL45HM3_A/I - Vishay - 3D model - Other - DO-221BC (SMPA)-1
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V4PAL45HM3_A/I Details

  • Manufacturer Part Number:

    V4PAL45HM3_A/I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMPA, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.12

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.57 V

  • JEDEC-95 Code:

    DO-221BC

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Reverse Current-Max:

    450 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

V4PAL45HM3_A/I Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the V4PAL45HM3_A/I is a rectangle with dimensions of 4.5mm x 3.5mm, with a 1.5mm x 1.5mm thermal pad in the center. The pad should be connected to a solid copper area on the PCB to ensure good thermal dissipation.
  • To ensure reliable soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pads. Use a reflow oven or a hot air gun to solder the component, and avoid applying excessive pressure or vibration during the soldering process.
  • The maximum operating temperature range for the V4PAL45HM3_A/I is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at temperatures above 125°C for extended periods.
  • The V4PAL45HM3_A/I is designed to withstand moderate vibrations, but it's not recommended for use in extremely high-vibration environments. If you must use the device in a high-vibration environment, ensure that the PCB is properly secured and the component is soldered securely to prevent mechanical stress.
  • The V4PAL45HM3_A/I has an integrated ESD protection diode, but it's still recommended to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded during assembly and testing.

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V4PAL45HM3_A/I Overview

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