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V5.5MLA0603LNR - LITTELFUSE

Description: Var MLV 4VAC/5.5VDC 30A 9.3V 0603 SMD T/R

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PCB Footprints
V5.5MLA0603LNR - LITTELFUSE PCB footprint - Varistors Chip - Varistors Chip - MLA 0603
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3D Models
V5.5MLA0603LNR - LITTELFUSE  - 3D model - Varistors Chip - MLA 0603
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V5.5MLA0603LNR Details

  • Manufacturer Part Number:

    V5.5MLA0603LNR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.40.00

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.25

  • Circuit RMS Voltage-Max:

    4 V

  • Energy Absorbing Capacity-Max:

    0.1 J

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, EMBOSSED PAPER, 7 INCH

  • Resistor Type:

    VARISTOR

  • Surface Mount:

    YES

  • Technology:

    METAL OXIDE

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Working Voltage:

    5.5 V

V5.5MLA0603LNR Frequently Asked Questions (FAQs)

  • The recommended land pattern for V5.5MLA0603LNR is a rectangular pad with a size of 1.3mm x 0.8mm, with a solder mask clearance of 0.1mm.
  • Yes, V5.5MLA0603LNR is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance may degrade at extreme temperatures.
  • To handle the ESD sensitivity of V5.5MLA0603LNR, it is recommended to use proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.
  • The recommended soldering profile for V5.5MLA0603LNR is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The device should be soldered using a solder with a melting point of 217°C or higher.
  • Yes, V5.5MLA0603LNR is suitable for high-frequency applications up to 1 GHz. However, the device's performance may degrade at higher frequencies.

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V5.5MLA0603LNR Overview

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