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V8PA15HM3/I - Vishay

Description: Schottky Diodes & Rectifiers If 8A Vrrm 150V AEC-Q101 Qualified

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V8PA15HM3/I - Vishay PCB footprint - Other - Other - V8PA15HM3/I-2
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V8PA15HM3/I - Vishay  - 3D model - Other - V8PA15HM3/I-2
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V8PA15HM3/I Details

  • Manufacturer Part Number:

    V8PA15HM3/I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Date Of Intro:

    2016-07-18

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.07

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JEDEC-95 Code:

    DO-221BC

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    150 V

  • Reverse Current-Max:

    500 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

V8PA15HM3/I Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a PCB layout with a large copper area connected to the tab of the device, and to use thermal vias to dissipate heat to the other side of the board. A minimum of 2 oz copper thickness is recommended.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the device.
  • The maximum allowed voltage imbalance between the input and output is ±10% of the nominal input voltage. Exceeding this limit may affect the device's reliability and performance.
  • To protect the device from overvoltage and overcurrent conditions, use a voltage regulator or a DC-DC converter with overvoltage protection (OVP) and overcurrent protection (OCP) features. Additionally, consider adding a fuse or a PTC thermistor in series with the device to prevent damage from excessive current.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the leads or the package. Use an anti-static wrist strap or mat when handling the device to prevent electrostatic discharge (ESD) damage.

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V8PA15HM3/I Overview

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Part Image V8PA15-M3/I Vishay Intertechnologies

Rectifier Diode, Schottky, 1 Phase, 1 Element, 2.2A, 150V V(RRM), Silicon, DO-221BC