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VA41630-PQ176F0PBA - VORAGO

Description: ARM Microcontrollers - MCU VA41630 - ARM Cortex M4 MCU - Rad. Hardened - 256KB NVM - 176 Plastic QFP

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PCB Footprints
VA41630-PQ176F0PBA - VORAGO PCB footprint - Quad Flat Packages - Quad Flat Packages - 176 Plastic QFP
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3D Models
VA41630-PQ176F0PBA - VORAGO  - 3D model - Quad Flat Packages - 176 Plastic QFP
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VA41630-PQ176F0PBA Details

  • Manufacturer Part Number:

    VA41630-PQ176F0PBA

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    QFP-176

  • ECCN Code:

    3A001.a.2.c

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    VORAGO Technologies

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G176

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    4

  • Number of I/O Lines:

    104

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    176

  • Number of Timers:

    24

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • RAM (bytes):

    327680

  • ROM (words):

    262144

  • ROM Programmability:

    FRAM

  • Screening Level:

    AEC-Q100; MIL-STD-883

  • Speed:

    100 MHz

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.97 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Position:

    QUAD

  • Total Dose:

    200k Rad(Si) V

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

VA41630-PQ176F0PBA Frequently Asked Questions (FAQs)

  • VORAGO recommends following the PCB layout guidelines in the datasheet and application notes. For thermal management, ensure a minimum of 1mm clearance around the device, use thermal vias, and consider a heat sink or thermal interface material.
  • Follow VORAGO's radiation-hardened design guidelines, use triple modular redundancy (TMR) or other mitigation techniques, and consult with VORAGO's application engineers for customized support.
  • VORAGO performs extensive radiation testing, including total ionizing dose (TID) and single-event effects (SEE) testing. Customers can request test reports and validation data from VORAGO.
  • Use the device's power-saving features, such as dynamic voltage and frequency scaling, and optimize your system's power management strategy. Consult VORAGO's application notes and power management guides for more information.
  • Follow VORAGO's EMI and RFI mitigation guidelines, use shielding, and implement proper grounding and decoupling techniques. Consult with VORAGO's application engineers for customized support.

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VA41630-PQ176F0PBA Overview

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