The manufacturer recommends a minimum of 1 oz copper thickness, 1.5 mm via diameter, and a 3.5 mm keep-out zone around the component. Additionally, a thermal pad on the bottom of the component with a minimum of 2 mm x 2 mm size.
The manufacturer recommends a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds. Hand soldering is not recommended due to the component's small size and high thermal mass.
The manufacturer recommends storing the component in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Handling should be done with anti-static wrist straps or mats to prevent ESD damage.
The manufacturer recommends against using the component in high-vibration environments (> 10 G) as it may lead to reduced reliability and lifespan. If vibration is unavoidable, the manufacturer recommends consulting with their application support team for customized solutions.
The manufacturer's typical lead time for production quantities is 8-12 weeks, depending on the specific configuration and quantity. It's recommended to consult with the manufacturer's sales team for accurate lead times and to plan accordingly.
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VBL3F0800C Overview
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