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VBUS054B-HSF-GS08 - Vishay

Description: Vishay VBUS054B-HSF-GS08 Quad Bi-Directional ESD Protection Array, 200W peak, 6-Pin LLP75

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PCB Footprints
VBUS054B-HSF-GS08 - Vishay PCB footprint - Other - Other - VBUS054B-HSF-GS08-3
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3D Models
VBUS054B-HSF-GS08 - Vishay  - 3D model - Other - VBUS054B-HSF-GS08-3
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VBUS054B-HSF-GS08 Details

  • Manufacturer Part Number:

    VBUS054B-HSF-GS08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, ULTRA COMPACT, PLASTIC, LLP75-6L, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    8 V

  • Breakdown Voltage-Min:

    6.3 V

  • Breakdown Voltage-Nom:

    7.2 V

  • Case Connection:

    CATHODE

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    200 W

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

VBUS054B-HSF-GS08 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for VBUS054B-HSF-GS08 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a 0.3 mm radius corner and a 0.2 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
  • The maximum operating temperature range for VBUS054B-HSF-GS08 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • Yes, VBUS054B-HSF-GS08 is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
  • Yes, VBUS054B-HSF-GS08 is compatible with lead-free soldering processes, and it meets the requirements of the RoHS (Restriction of Hazardous Substances) directive.

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VBUS054B-HSF-GS08 Overview

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