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VBUS054DD-HF4-GS08 - Vishay

Description: ESD Suppressors / TVS Diodes ESD PROTECTION DIODE LLP1010-e4

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VBUS054DD-HF4-GS08 - Vishay PCB footprint - Other - Other - VBUS054DD-HF4-GS08-2
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3D Models
VBUS054DD-HF4-GS08 - Vishay  - 3D model - Other - VBUS054DD-HF4-GS08-2
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VBUS054DD-HF4-GS08 Details

  • Manufacturer Part Number:

    VBUS054DD-HF4-GS08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, LLP1010-5L, 5 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    8.7 V

  • Breakdown Voltage-Min:

    6.9 V

  • Breakdown Voltage-Nom:

    8 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    16 V

  • Configuration:

    COMMON CATHODE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    45 W

  • Number of Elements:

    4

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

VBUS054DD-HF4-GS08 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper pad under the device, connected to a solid ground plane, and to use thermal vias to dissipate heat. Additionally, keeping the PCB layer stack-up symmetrical and using a thermal relief pattern around the device can help to reduce thermal resistance.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the device. Avoid using excessive solder or flux, and ensure the PCB is clean and dry before soldering.
  • Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and to prevent damage to the device. Exceeding the maximum input voltage can lead to device failure or reduced lifespan.
  • To handle ESD protection, ensure that the device is handled and stored in an ESD-protected environment. Use ESD-protective packaging, wrist straps, and mats when handling the device. Additionally, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design to protect the device from electrostatic discharge.
  • Although the datasheet specifies an operating temperature range of -40°C to 125°C, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability. Operating the device outside this range may affect its performance, lifespan, or reliability.

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