VDRS10P460BSE footprint, schematic symbol and 3D model by Vishay

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VDRS10P460BSE Details

The recommended PCB footprint for VDRS10P460BSE is a rectangular pad with dimensions of 5.08mm x 3.81mm, with a thermal pad of 2.54mm x 2.54mm in the center. The pad should have a solder mask defined (SMD) and a solder paste layer.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and a solder paste with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pad, and place the component on the pad. Use a reflow oven or a hot air gun to solder the component.
The maximum operating temperature range for VDRS10P460BSE is -55°C to 150°C. However, the device is typically rated for operation up to 125°C for most applications.
VDRS10P460BSE has an integrated ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded.
Store VDRS10P460BSE in a dry, cool place with a temperature range of 20°C to 30°C and relative humidity of 50% to 60%. Avoid exposing the devices to direct sunlight, moisture, or extreme temperatures.

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