CUI recommends a PCB layout with a large copper area for heat dissipation, and thermal vias to connect to a heat sink or a metal core PCB. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) can be used to improve heat transfer between the module and the heat sink.
To ensure reliable start-up and shutdown, CUI recommends a soft-start circuit to limit inrush current, and a shutdown circuit to prevent voltage spikes. The module should also be powered up and down slowly to prevent electrical stress.
CUI provides derating curves for temperature and altitude in their application notes. The module's power rating decreases by 2.5% per degree Celsius above 40°C, and by 1% per 1,000 feet above sea level.
Yes, the VHB50W-Q24-S28 can be used in a redundant or parallel configuration, but CUI recommends consulting their application notes and performing thorough testing to ensure reliable operation and to prevent unwanted interactions between modules.
CUI recommends following proper EMI and EMC design practices, such as using a metal enclosure, shielding, and filtering, to minimize electromagnetic interference and ensure compliance with relevant standards.
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VHB50W-Q24-S28 Overview
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