The recommended land pattern for VJ0805A681KXAAC is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
VJ0805A681KXAAC is a moisture-sensitive device (MSD). To handle it, follow the recommended storage and handling procedures, such as storing the components in a dry, nitrogen-filled environment, and baking the components before reflow soldering if they have been exposed to moisture.
The maximum reflow temperature for VJ0805A681KXAAC is 260°C, with a peak temperature not exceeding 240°C for more than 20 seconds. Exceeding this temperature may cause damage to the component.
While VJ0805A681KXAAC is a robust component, it's essential to consider the vibration environment and potential mechanical stress. Vishay recommends following the recommended mounting and soldering procedures to ensure the component's reliability in high-vibration applications.
The ESR of VJ0805A681KXAAC is not explicitly stated in the datasheet. However, according to Vishay's application notes, the ESR of similar components in the VJ0805 series is typically in the range of 10-20 mΩ. For specific ESR values, consult with Vishay's technical support or refer to the component's Spice model.
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VJ0805A681KXAAC Overview
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