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VJ0805A820KXAPW1BC - Vishay

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT 0805 82pF 50volts C0G 10%

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VJ0805A820KXAPW1BC - Vishay - PCB symbol
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PCB Footprints
VJ0805A820KXAPW1BC - Vishay PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - VJ0805/2022
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3D Models
VJ0805A820KXAPW1BC - Vishay - 3D model - Capacitor Chip Non-polarised - VJ0805/2022
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VJ0805A820KXAPW1BC Details

  • Manufacturer Part Number:

    VJ0805A820KXAPW1BC

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, HALOGEN FREE AND ROHS COMPLIANT

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Capacitance:

    0.000082 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    0.75 mm

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, PAPER, 13 INCH

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    50 V

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    C0G

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Width:

    1.25 mm

VJ0805A820KXAPW1BC Frequently Asked Questions (FAQs)

  • The recommended land pattern for VJ0805A820KXAPW1BC is a rectangular pad with a size of 0.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1 mm.
  • To handle thermal management, ensure good thermal conduction by using a thermal pad or a heat sink. The component's thermal resistance (RthJA) is 30 K/W, so a thermal pad or heat sink with a thermal resistance of less than 10 K/W is recommended.
  • The maximum operating temperature range for VJ0805A820KXAPW1BC is -55°C to +125°C. However, the component's electrical characteristics may degrade above 85°C, so it's recommended to operate within the -40°C to +85°C range for optimal performance.
  • Yes, VJ0805A820KXAPW1BC is designed to withstand high-vibration environments. It meets the vibration test requirements of IEC 60068-2-6, which includes sinusoidal vibration at 10-2000 Hz and a maximum acceleration of 10 g.
  • To ensure reliability in a humid environment, follow proper storage and handling procedures to prevent moisture absorption. Use a moisture barrier bag or dry pack to store the components, and bake them at 125°C for 24 hours before assembly if they have been exposed to high humidity.

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VJ0805A820KXAPW1BC Overview

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Part Image C0805X820K5GAL7210 KEMET Corporation

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For a full list of alternate parts for VJ0805A820KXAPW1BC, check out Findchips.com