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VLA106-24242 - POWEREX

Description: DC DC CONVERTER 24V 2W

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PCB Footprints
VLA106-24242 - POWEREX PCB footprint - Other - Other - VLA106-24242-1
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3D Models
VLA106-24242 - POWEREX  - 3D model - Other - VLA106-24242-1
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VLA106-24242 Details

  • Manufacturer Part Number:

    VLA106-24242

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Package Description:

    SIP-7

  • Pin Count:

    7

  • ECCN Code:

    EAR99

  • Manufacturer:

    Powerex Power Semiconductors

  • YTEOL:

    6.3

  • Additional Feature:

    ADDITIONAL 8.2 V OUTPUT AVAILABLE

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    26.4 V

  • Input Voltage-Min:

    21.6 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-XSMA-T7

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    7

  • Output Voltage-Max:

    25.2 V

  • Output Voltage-Min:

    22.8 V

  • Output Voltage-Nom:

    24 V

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    2.4 W

  • Trim/Adjustable Output:

    NO

VLA106-24242 Frequently Asked Questions (FAQs)

  • A symmetrical layout with a large copper area for heat dissipation is recommended. Ensure a minimum of 2 oz copper thickness and a thermal relief pattern around the device.
  • Implement a proper heat sink design, ensure good airflow, and consider using a thermal interface material (TIM) to reduce thermal resistance. Monitor junction temperature and adjust the design accordingly.
  • A gate drive circuit with a voltage source, resistor, and capacitor (VRC) configuration is recommended. Ensure a minimum gate drive voltage of 15 V and a maximum of 20 V.
  • Implement overcurrent protection using a current sense resistor and a comparator. For overvoltage protection, use a voltage clamp circuit or a transient voltage suppressor (TVS) diode.
  • Use a wire bonding technique with a minimum wire diameter of 0.5 mm and a maximum bond force of 10 N. For soldering, use a solder with a melting point above 220°C and follow the recommended soldering profile.

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VLA106-24242 Overview

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