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VLCF5024T-470MR40-2 - TDK

Description: SMD / SMT Inductors (Coils), L=47μH, L x W x T :

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PCB Footprints
VLCF5024T-470MR40-2 - TDK PCB footprint - Other - Other - VLCF5024-2
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VLCF5024T-470MR40-2 - TDK  - 3D model - Other - VLCF5024-2
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VLCF5024T-470MR40-2 Details

  • Manufacturer Part Number:

    VLCF5024T-470MR40-2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    2020

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.383 Ω

  • Inductance-Nom (L):

    47 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.4 mm

  • Package Length:

    5 mm

  • Package Style:

    SMT

  • Package Width:

    5 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    1.05 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

VLCF5024T-470MR40-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for VLCF5024T-470MR40-2 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the VLCF5024T-470MR40-2, especially in high-power applications. TDK recommends using a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad should be placed on the bottom of the component, and the heat sink should be attached to the thermal pad using a thermal interface material. Additionally, ensuring good airflow around the component can also help to reduce the temperature.
  • The maximum operating temperature range for VLCF5024T-470MR40-2 is -40°C to +125°C, as specified in the datasheet. However, it's recommended to derate the component's performance at higher temperatures to ensure reliability and longevity.
  • The VLCF5024T-470MR40-2 is designed to withstand moderate vibration levels, but it's not recommended for use in extremely high-vibration environments. If your application requires operation in a high-vibration environment, you should consider using a component with a higher vibration rating or taking additional measures to secure the component, such as using a vibration-dampening material or a more robust PCB design.
  • To ensure the reliability of VLCF5024T-470MR40-2 in a humid environment, it's recommended to use a conformal coating or a moisture-resistant material to protect the component from moisture ingress. Additionally, ensuring good PCB design practices, such as using a robust soldering process and avoiding moisture-trapping areas, can also help to prevent moisture-related issues.

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VLCF5024T-470MR40-2 Overview

Use the download button to access the VLCF5024T-470MR40-2 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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