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VLCF5024T-6R8N1R1-2 - TDK

Description: SMD / SMT Inductors (Coils), L=6.8μH, L x W x T :

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PCB Footprints
VLCF5024T-6R8N1R1-2 - TDK PCB footprint - Other - Other - VLCF5024-2
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VLCF5024T-6R8N1R1-2 - TDK  - 3D model - Other - VLCF5024-2
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VLCF5024T-6R8N1R1-2 Details

  • Manufacturer Part Number:

    VLCF5024T-6R8N1R1-2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    2020

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.061 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.4 mm

  • Package Length:

    5 mm

  • Package Style:

    SMT

  • Package Width:

    5 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    2.62 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    30%

VLCF5024T-6R8N1R1-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for VLCF5024T-6R8N1R1-2 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of VLCF5024T-6R8N1R1-2. It is recommended to use a thermal pad or a heat sink to dissipate heat generated by the inductor. The thermal pad or heat sink should be designed to provide good thermal conductivity and should be attached to the inductor using a thermally conductive adhesive or solder.
  • The maximum operating temperature range for VLCF5024T-6R8N1R1-2 is typically specified as -40°C to +125°C, but it's recommended to check the datasheet or consult with TDK Corporation's customer support for the exact temperature range, as it may vary depending on the specific application and environment.
  • To ensure the reliability of VLCF5024T-6R8N1R1-2 in high-vibration environments, it is recommended to use a secure mounting method, such as soldering or using a mechanical fastener, to prevent the inductor from moving or detaching from the PCB. Additionally, it's recommended to use a vibration-resistant adhesive or potting material to further secure the inductor.
  • The recommended storage and handling procedure for VLCF5024T-6R8N1R1-2 typically involves storing the components in a dry, cool place, away from direct sunlight and moisture. It's also recommended to handle the components by the edges or body, rather than the leads or pins, to prevent damage or contamination.

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VLCF5024T-6R8N1R1-2 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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