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VLS2012ET-1R0N - TDK

Description: SMD / SMT Inductors (Coils), L=1?H, L x W x T :

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PCB Footprints
VLS2012ET-1R0N - TDK PCB footprint - Other - Other - VLS2012
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3D Models
VLS2012ET-1R0N - TDK  - 3D model - Other - VLS2012
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VLS2012ET-1R0N Details

  • Manufacturer Part Number:

    VLS2012ET-1R0N

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    3

  • Case/Size Code:

    0808

  • Construction:

    Shielded

  • Core Material:

    FERRITE

  • DC Resistance:

    0.071 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    1.45 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER PLATINUM

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    30%

VLS2012ET-1R0N Frequently Asked Questions (FAQs)

  • The recommended land pattern for VLS2012ET-1R0N can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of VLS2012ET-1R0N. It is recommended to use a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad or heat sink should be designed to ensure good thermal conductivity and should be attached to the component using a thermally conductive adhesive or solder.
  • The maximum operating temperature range for VLS2012ET-1R0N is typically specified in the datasheet as -40°C to +125°C. However, it is recommended to derate the component's performance and reliability at higher temperatures to ensure optimal operation and to prevent thermal runaway.
  • To ensure the reliability of VLS2012ET-1R0N in high-vibration environments, it is recommended to use a robust mounting method, such as soldering or adhesive bonding, to secure the component to the PCB. Additionally, the PCB should be designed to minimize flexure and vibration, and the component should be located in a area with minimal vibration and shock.
  • The recommended storage and handling procedure for VLS2012ET-1R0N is to store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. The components should be handled using anti-static wrist straps or mats to prevent electrostatic discharge (ESD) damage.

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VLS2012ET-1R0N Overview

Use the download button to access the VLS2012ET-1R0N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VLS20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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