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VLS2012ET-3R3M - TDK

Description: TDK VLS-E Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 3.3 μH 0.84A Idc

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PCB Footprints
VLS2012ET-3R3M - TDK PCB footprint - Other - Other - VLS2012
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3D Models
VLS2012ET-3R3M - TDK  - 3D model - Other - VLS2012
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VLS2012ET-3R3M Details

  • Manufacturer Part Number:

    VLS2012ET-3R3M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    3

  • Case/Size Code:

    0808

  • Construction:

    Shielded

  • Core Material:

    FERRITE

  • DC Resistance:

    0.19 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e4

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    0.84 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER PLATINUM

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

VLS2012ET-3R3M Frequently Asked Questions (FAQs)

  • The recommended land pattern for VLS2012ET-3R3M can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • While the VLS2012ET-3R3M is rated for operation up to 125°C, it's essential to consider the derating curves and temperature coefficients specified in the datasheet. Additionally, it's recommended to consult with TDK Corporation's application engineers to ensure the component can meet the specific requirements of your high-temperature application.
  • To handle the ESD sensitivity of VLS2012ET-3R3M, it's recommended to follow proper ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Additionally, consider implementing ESD protection circuits or devices in your design to prevent damage from electrostatic discharge.
  • While the VLS2012ET-3R3M is designed to be robust, it's essential to consider the vibration specifications and ensure that the component is properly mounted and secured to withstand the expected vibration levels. Consult with TDK Corporation's application engineers for guidance on vibration testing and validation.
  • The recommended soldering profile for VLS2012ET-3R3M can be found in the TDK Corporation's soldering guidelines document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended soldering temperature, time, and other parameters for optimal solder joint reliability.

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VLS2012ET-3R3M Overview

Use the download button to access the VLS2012ET-3R3M schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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