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VLS201612CX-1R0M-1 - TDK

Description: SMD / SMT Inductors (Coils), L=1?H, L x W x T :

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VLS201612CX-1R0M-1 - TDK PCB footprint - Other - Other - VLS2016
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VLS201612CX-1R0M-1 - TDK  - 3D model - Other - VLS2016
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VLS201612CX-1R0M-1 Details

  • Manufacturer Part Number:

    VLS201612CX-1R0M-1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    0806

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.068 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    2.16 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

VLS201612CX-1R0M-1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the VLS201612CX-1R0M-1 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 2.5mm x 1.6mm, with a 0.5mm hole in the center for the component's terminal.
  • To handle thermal considerations, ensure a minimum of 1mm clearance around the component to allow for airflow. Also, consider using thermal vias or a thermal pad on the PCB to dissipate heat. Consult the datasheet for the component's thermal resistance and recommended operating temperature range.
  • The recommended soldering profile for the VLS201612CX-1R0M-1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. However, it's recommended to consult the datasheet or TDK Corporation's application note for the most up-to-date and specific soldering profile guidelines.
  • To ensure reliability and prevent failure due to moisture, follow the recommended storage and handling procedures outlined in the datasheet. Also, consider using a moisture-resistant coating or conformal coating on the PCB to protect the component from moisture ingress.
  • To prevent ESD damage, handle the component in an ESD-protected environment, wear an ESD wrist strap or use ESD-safe tools, and avoid touching the component's pins or terminals. Also, ensure the PCB is properly grounded during assembly and testing.

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VLS201612CX-1R0M-1 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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