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VLS252012HBU-100M - TDK

Description: SMD / SMT Inductors (Coils), L=10?H, L x W x T :

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PCB Footprints
VLS252012HBU-100M - TDK PCB footprint - Other - Other - VLS2520
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3D Models
VLS252012HBU-100M - TDK  - 3D model - Other - VLS2520
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VLS252012HBU-100M Details

  • Manufacturer Part Number:

    VLS252012HBU-100M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    METAL CORE

  • DC Resistance:

    0.672 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    0.8 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

VLS252012HBU-100M Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the TDK Corporation's application note or design guide for the VLS252012HBU-100M. It's essential to follow the recommended layout to ensure optimal performance, low EMI, and high reliability.
  • The VLS252012HBU-100M has a maximum operating temperature of 125°C. To ensure reliable operation, it's crucial to provide adequate thermal management, such as using a heat sink or thermal pad, and ensuring good airflow around the component.
  • The recommended soldering profile for the VLS252012HBU-100M can be found in the TDK Corporation's soldering guide or application note. A typical reflow soldering profile would include a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C.
  • To ensure proper decoupling and filtering, it's recommended to use a combination of ceramic capacitors and ferrite beads in the power supply lines. The values and placement of these components will depend on the specific application and operating frequency.
  • The VLS252012HBU-100M is a sensitive component and requires proper ESD protection during handling and assembly. It's recommended to follow standard ESD handling precautions, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging.

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VLS252012HBU-100M Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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