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VLS252012HBX-3R3M-1 - TDK

Description: SMD / SMT Inductors (Coils), L=3.3?H, L x W x T :

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VLS252012HBX-3R3M-1 - TDK - PCB symbol
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PCB Footprints
VLS252012HBX-3R3M-1 - TDK PCB footprint - Other - Other - VLS2520
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VLS252012HBX-3R3M-1 - TDK - 3D model - Other - VLS2520
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VLS252012HBX-3R3M-1 Details

  • Manufacturer Part Number:

    VLS252012HBX-3R3M-1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Malaysia, South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    METAL CORE

  • DC Resistance:

    0.168 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    1.55 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

VLS252012HBX-3R3M-1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the VLS252012HBX-3R3M-1 can be found in the TDK Corporation's application note or on their website. It typically includes a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm keep-out area around the component.
  • The VLS252012HBX-3R3M-1 has a thermal resistance of 10°C/W. To handle thermal management, ensure good airflow around the component, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and consider using a heat sink or thermal pad if the operating temperature exceeds 85°C.
  • The maximum operating temperature range for the VLS252012HBX-3R3M-1 is -40°C to 125°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range.
  • The VLS252012HBX-3R3M-1 is designed to withstand vibrations up to 10G. However, it's recommended to consult with TDK Corporation or a qualified engineer to ensure the component's reliability in high-vibration environments.
  • The recommended soldering profile for the VLS252012HBX-3R3M-1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the soldering profile recommended by TDK Corporation or a qualified engineer to prevent damage to the component.

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VLS252012HBX-3R3M-1 Overview

Use the download button to access the VLS252012HBX-3R3M-1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VLS25, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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