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VLS3012CX-3R3M-1 - TDK

Description: SMD / SMT Inductors (Coils), L=3.3?H, L x W x T :

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VLS3012CX-3R3M-1 - TDK PCB footprint - Other - Other - VLS3012
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VLS3012CX-3R3M-1 - TDK  - 3D model - Other - VLS3012
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VLS3012CX-3R3M-1 Details

  • Manufacturer Part Number:

    VLS3012CX-3R3M-1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1212

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.107 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    3 mm

  • Package Style:

    SMT

  • Package Width:

    3 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    1.99 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

VLS3012CX-3R3M-1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the VLS3012CX-3R3M-1 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The VLS3012CX-3R3M-1 has a high power density, and proper thermal management is crucial to ensure its reliability and performance. Engineers should consider using thermal vias, thermal pads, or heat sinks to dissipate heat away from the component. The thermal resistance of the component should also be taken into account during the design process.
  • The maximum operating temperature range for the VLS3012CX-3R3M-1 is typically specified in the datasheet, but it's essential to note that the component's performance and reliability may degrade at higher temperatures. Engineers should ensure that the component is operated within the recommended temperature range to ensure optimal performance and reliability.
  • Proper soldering and assembly techniques are critical to ensure the reliability and performance of the VLS3012CX-3R3M-1. Engineers should follow the recommended soldering profile and assembly guidelines provided by TDK Corporation or industry standards such as IPC-J-STD-001. Additionally, using a soldering iron with a temperature control and a flux suitable for the component's termination finish is essential.
  • The VLS3012CX-3R3M-1 is a sensitive component and requires proper ESD protection and handling to prevent damage. Engineers should follow standard ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Additionally, the component should be stored in a dry, ESD-safe environment to prevent moisture and ESD damage.

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VLS3012CX-3R3M-1 Overview

Use the download button to access the VLS3012CX-3R3M-1 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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