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VN750SMP-E - STMicroelectronics

Description: Power Switch ICs - Power Distribution High Side Driver 55mOhm 6A 26V

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VN750SMP-E - STMicroelectronics - PCB symbol
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VN750SMP-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-8 1.75mm thickness
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VN750SMP-E Details

  • Manufacturer Part Number:

    VN750SMP-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Output Current Flow Direction:

    SOURCE

  • Output Current-Max:

    2 A

  • Output Peak Current Limit-Nom:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    30 µs

  • Turn-on Time:

    40 µs

  • Width:

    3.9 mm

VN750SMP-E Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5333, which includes guidelines for thermal pad connection, copper pouring, and via placement to ensure optimal thermal performance.
  • The VN750SMP-E has a low-power mode that can be enabled by setting the EN pin low. Additionally, the device can be configured for low-power mode by setting the appropriate registers through the SPI interface. Refer to the device's programming guide for more information.
  • The VN750SMP-E is rated for operation from -40°C to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, the VN750SMP-E is designed to withstand high-vibration environments. However, it's crucial to follow proper mounting and soldering techniques to ensure the device remains securely attached to the PCB. STMicroelectronics recommends using a suitable vibration-resistant mounting method, such as a screw or clip.
  • To troubleshoot SPI communication issues, check the clock frequency, polarity, and phase settings. Ensure that the master and slave devices are properly configured and that the SPI bus is not overloaded. Use a logic analyzer or oscilloscope to verify the signal integrity and timing.

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VN750SMP-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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