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VND5E008AYTR-E - STMicroelectronics

Description: Double channel high-side driver with analog current sense for automotive applications

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VND5E008AYTR-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PWSSO 36_2022-2
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VND5E008AYTR-E - STMicroelectronics - 3D model - Small Outline Packages - PWSSO 36_2022-2
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VND5E008AYTR-E Details

  • Manufacturer Part Number:

    VND5E008AYTR-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    ROHS COMPLIANT, SSOP-36

  • Pin Count:

    36

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.15

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G36

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    76 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP36,.4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.47 mm

  • Supply Voltage-Max:

    28 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

VND5E008AYTR-E Frequently Asked Questions (FAQs)

  • A good PCB layout for the VND5E008AYTR-E involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal pad to dissipate heat efficiently.
  • The VND5E008AYTR-E has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, grounding straps, and wrist straps to prevent damage to the device.
  • To troubleshoot issues with the VND5E008AYTR-E, start by checking the input voltage, output voltage, and current consumption. Verify that the device is properly soldered and that there are no signs of physical damage. Use an oscilloscope to analyze the input and output waveforms, and consult the datasheet and application notes for guidance.
  • The VND5E008AYTR-E has a maximum junction temperature of 150°C. Ensure good airflow around the device, use a heat sink or thermal pad if necessary, and avoid blocking the airflow around the device. Monitor the device temperature and adjust the thermal management strategy accordingly.

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VND5E008AYTR-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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