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VND5E160MJTR-E - STMicroelectronics

Description: Double-channel high-side driver with analog current sense for automotive applications

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VND5E160MJTR-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSSO-12 height 1.62
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VND5E160MJTR-E Details

  • Manufacturer Part Number:

    VND5E160MJTR-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, SSO-12

  • Pin Count:

    12

  • Country Of Origin:

    Morocco

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7.05

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G12

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Output Current Flow Direction:

    SOURCE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SOP12,.25,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.62 mm

  • Supply Voltage-Max:

    28 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    15 µs

  • Turn-on Time:

    10 µs

  • Width:

    3.9 mm

VND5E160MJTR-E Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a PCB layout with a large copper area connected to the thermal pad to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a solid copper plane on the PCB.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, including a proper heat sink design, and to ensure that the device is operated within the specified temperature range (TJ = -40°C to 150°C).
  • STMicroelectronics recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 30-45 seconds, and a total process time of 60-90 seconds. The device should be soldered using a no-clean flux and a solder alloy with a melting point above 217°C.
  • To prevent damage, the device should be stored in its original packaging or in a similar ESD-protective package. The device should be handled with ESD-protective materials, and it should not be exposed to temperatures above 150°C or humidity above 60%.
  • STMicroelectronics recommends characterizing the device under the following test conditions: VCC = 5V, TA = 25°C, and RL = 10kΩ. The device should be tested in a controlled environment with minimal noise and electromagnetic interference.

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VND5E160MJTR-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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